Upcoming webinars

Upcoming Webinars Charting the future of efficient energy production and usage June 23rd @ 9:00am PT / 12:00pm ET The energy industry finds itself facing a range of transformational developments, from fluctuating demand and the generation decentralization, to system integration and the Internet of Things. Automation specialist B&R and Intel are helping the energy industry, and system integrators that serve them, respond and make the most of new opportunities. Automotive Ethernet Compliance Testing June 24th @ 8:00am PT / 11:00am ET With the introduction of Ethernet in cars, a new class of interface quality tests is required. The OPEN alliance has released a test specification for BroadR-Reach Ethernet. The compliance test focuses similar to most Ethernet compliance test specifications of the IEEE on transmitter quality. In this webinar, details will be provided on the individual test cases of the compliance test as well as hints on the required test setup. Real-Time Audio and Industrial Applications Enabled by Multicore SHARC DSP + ARM SOC June 24th @ 9:00am PT / 12:00pm ET Targeting real-Time Audio & Industrial applications, this next generation power efficient SHARC series delivers high performance DSP ( 24GFLOPS @ < 2W ) with two SHARC+ cores and advanced DSP accelerators. ADSP-SC58x products integrate an ARM Cortex-A5 processor for connectivity options including Gigabit Ethernet, USB, SDIO and more. This webcast reviews the key features and benefits of this new product family, use case examples & development tools. TRENCHSTOP™ 5 IGBT discrete product families June 25th @ 8:00am PT / 11:00am ET We'd like to invite you to the webinar about the world's best-in-class TRENCHSTOP™ 5 IGBT technology and 5 discrete IGBT product families. Attendees will learn: The Best-in-class TRENCHSTOP™ 5 IGBT technology and 5 product families based on the TRENCHSTOP™ 5 The differences between 5 product families based on the TRENCHSTOP™ 5 The positions of each of the TRENCHSTOP™ 5 product families The benefits and advantages of customers using one of the 5 TRENCHSTOP™ 5 product families

ISE Configuration and Programming Overview

After generating a programming file using the Generate Programming File process, you can configure your device, create PROM, System ACE™ solution, SVF, XSVF, or STAPL files. You can configure FPGAs or program Xilinx® CPLDs or PROMs in-system, directly from a host-computer using iMPACT with a Xilinx download cable.

Note For detailed information on using iMPACT, see the iMPACT Help. In the Help Viewer, click the Synchronize TOC button to view all related Help topics.

To Configure or Program a Device

To configure or program a device, do the following:

1.  Connect the cable to an appropriate port on the host computer and to the correct pins on the target board.
   When setting up the configuration chain and target device to configure or program a device, select the appropriate configuration mode, which is used to connect to the board from your Xilinx download cable. The most commonly used mode is Boundary Scan. When using this mode, you must connect the cable leads to the following pins: TDO, TDI, TCK, TMS, VCC, and GND. For more information, see the Data Sheets or Device User Guides the for the device you are targeting.
2.  In the Design panel, select Implementation from the Design View drop-down list.
3.  In the Hierarchy pane, select the top module .
4.  Optional. Right-click Configure Target Device, and select Process Properties to set the Configure Target Device Properties.
5.  In the Processes pane, double-click Configure Target Device
   The first time you configure your device, the tools walk you through the process of setting up a configuration chain and designating your target device. On subsequent runs, the tools use the settings stored in your iMPACT Project File (IPF). To edit the IPF file, use the Manage Configuration Project (iMPACT) process.

To Generate Related Configuration Files

Optionally, you can generate configuration files to program a configuration device, such as a PROM or System ACE device, or to use with other software programs as follows:

1.  In the Design panel, select Implementation from the Design View drop-down list.
2.  In the Hierarchy pane, select the top module .
3.  In the Processes pane, expand Configure Target Device, and do one of the following:
   •  To generate PROM/ACE files (FPGAs only), double-click Generate Target PROM/ACE File.
   •  To generate JTAG (SVF/XSVF/STPL) files (FPGAs and CPLDs), double-click Manage Configuration Project (iMPACT). For more information, see Generating an SVF, XSVF, or STAPL File.
     The first time you configure your device, the tools walk you through the process of setting up your configuration project options. On subsequent runs, the tools use the settings stored in your iMPACT Project File (IPF). To edit the IPF file, use the Manage Configuration Project (iMPACT) process.

PROM Files

Xilinx FPGAs are CMOS configurable latch (CCL)-based and must be configured every time power is cycled from a non-volatile source. The most common method of programming Xilinx FPGAs is by using Xilinx PROMs connected to a chain of FPGAs. PROM files include information on the FPGA chain length and contain bitstreams that are reformatted for use with PROM programmers. Several PROM file formats are available: MCS, EXO, TEK, HEX, UFP, BIN, and ISC. iMPACT can directly program Xilinx PROM devices using MCS, EXO, and ISC file formats. In addition, some Xilinx FPGA families can be configured using supported SPI or BPI Flash devices. You must program these memory devices using PROM files created from the bitstreams of the targeted FPGAs.

When you create a PROM file using iMPACT, you must select one of the following types of PROM files to target:

•  Xilinx Flash/PROM
  iMPACT generates a PROM file you can use to program a Xilinx Flash/PROM (18V00, XCFxxS, XCFxxP, or XCF128X). iMPACT can directly program Xilinx Flash/PROM devices using MCS, EXO, and ISC file formats. If you are using a third party programmer, check the documentation that came with the software to see if a particular format is required.
•  Non-Volatile FPGA
  Spartan®-3AN devices are non-volatile FPGAs, which have internal Flash that is programmed using MCS, EXO, or ISC formatted files.
•  Serial Peripheral Interface (SPI) Flash
  SPI is a serial interface standard most commonly used in microprocessor and memory applications. SPI Flash uses this interface to provide direct access to memory addresses, only requiring a 4-pin interface to configure the FPGA. Certain Xilinx FPGAs support direct configuration using an SPI Flash. These FPGAs can be configured from the SPI Flash using a single image or a multiple-imaged PROM file. The multiple-imaged PROM file enables FPGA multi-boot applications. To program third party SPI Flash devices, iMPACT generates a PROM file.
•  Byte Peripheral Interface (BPI) Flash
  BPI is the Xilinx version of the standard parallel NOR flash interface (x8 and x16). Certain Xilinx FPGAs support direct configuration using a BPI Flash. These FPGAs can be configured from the BPI Flash using a single image or a multiple-imaged PROM file. The multiple-imaged PROM file enables FPGA multi-boot applications. For applications requiring larger data bus widths, you can use the Configure from Paralleled PROMs utility in iMPACT, which allows you to combine two x16 Xilinx PROMs together to create a x32 file format.
•  Generic Parallel PROM
  iMPACT generates a PROM file that you can use to program parallel PROMs made by third party companies. These PROMs are typically byte-wide, directly-accessible memory devices that require addresses for certain pins so that specific locations can be read. iMPACT allows you to generate PROM files for parallel PROMs; it does not support programming of parallel PROMs.

Note For information on which FPGAs support direct configuration by SPI and BPI Flash, see the Data Sheets or Device User Guides the for the device you are targeting.

System ACE CompactFlash (CF) Files

Xilinx System Advanced Configuration Environment (ACE) files are used with the System ACE device family, which features greater capacity and flexibility than Xilinx PROMs. The System ACE CompactFlash (CF) solution allows you to program an FPGA target chain or chains. This configuration solution is a chipset, which comprises an ACE controller device and a CompactFlash storage device.

Note For more information on using iMPACT to generate these files, see System ACE CF Settings. For more information on the System ACE CompactFlash solution, see the System ACE CF Solution Data Sheet.

Boundary Scan or JTAG Vector Files

Boundary scan files, also known as JTAG files, are script files that describe a sequence of boundary scan commands and data. To create these script files, iMPACT records the sequence of boundary scan actions in iMPACT and writes these sequences to the script file. Following are the different file formats and their uses:

•  SVF and STAPL files
  You can use serial vector format (SVF) files and STAPL files with automated test equipment (ATE) to test boards and to program Xilinx devices before sending the boards to your customers.
•  XSVF files
  You can use the Xilinx serial vector format (XSVF) file for embedded systems in which the FPGA is configured by an on-board microprocessor.

Note For information on boundary scan file generation, see Boundary-Scan Files.

Additional Resources

Additional information is available in the following Xilinx documentation.

Documentation	Topics Covered
Device User Guides	Device-specific configuration information
Data Sheets	Device specifications, including I/O standards
Common Issues and Debug Solutions	Troubleshooting information for configuration and programming
iMPACT Help Note In the Help Viewer, click the Synchronize TOC button to view all related Help topics.	iMPACT software

Cypress Newsletter

In This Issue Synchronous and Asynchronous SRAMs Product Update Featured White Papers Product Features Featured Videos Roadmaps EVP Corner Synchronous and Asynchronous SRAMs The Role of SRAMs in Next-Generation IoT and Wearable Embedded Designs Standalone static random access memory (SRAM) devices are returning to mainstream embedded system design due to the requirements of newer applications such as wearable electronics and the Internet of Things. Read more... Cypress QDR-IV SRAMs Enable World's Lowest Latency Network Switch Networking equipment maker  Exablaze has selected Cypress's QDR-IV SRAM for its ExaLINK Fusion networking switch. The switch utilizes a modular design implemented using a Xilinx Ultrascale FPGA interfaced to a QDR-IV memory. The ExaLINK Fusion leverages Cypress's fastest QDR-IV device running at 1066 MHz, which provides the highest Random Transaction Rate (RTR) of any memory on the market. Read more... Product Update Cypress and Spansion Complete $5 Billion Merger Cypress and Spansion have completed a merger of the two companies valued at $5 billion. The newly combined company delivers high-performance, high-quality solutions at the heart of today's most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes NOR flash memories, F-RAM™ and SRAM, Traveo™ microcontrollers, the industry's only PSoC® programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense® capacitive touch-sensing controllers, and Wireless BLE Bluetooth® Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, best-in-class support and exceptional system value. Learn more... Cypress Introduces the Industry's First 4Mb Serial F-RAM Cypress introduces a new family of 4Mb F-RAMs, the highest density serial F-RAMs in the industry. This family offers a 40-Mhz Serial Peripheral Interface (SPI), a 2.0V to 3.6V operating voltage range and industry-standard, RoHS-compliant package options 8SOIC and 8TDFN. The 4Mb Serial F-RAM is the ideal solution for storing critical data in mission-critical applications including multifunction printers, industrial controls and automation, medical wearables, test and measurement equipment and smart meters. Learn more by reading the press release or visiting the web page at www.cypress.com/4MbFRAM . Engineering samples are available now and full Production is scheduled to complete in Q4. Cypress Adds 4Mb Asynchronous SRAM and 36Mb Synchronous SRAMs to the Family of SRAMs with On-Chip Error-Correcting Code Cypress has announced the sampling of 4Mb asynchronous and 36Mb synchronous SRAMs with Error-Correcting Code (ECC). 16Mb asynchronous SRAMs with ECC, introduced last year,  were the first Cypress SRAMs to have on-chip ECC. Cypress also plans to add other high-density, high-performance synchronous SRAMs to its current portfolio of ECC memories. For more details on 36Mb synchronous SRAM refer to http://www.cypress.com/syncnoblecc/ and for 4-MB Asynchronous SRAM refer to http://www.cypress.com/AsyncSRAMECC/ Spansion HyperBus™ Interface Enables Breakthrough Read Throughput Speeds NOR flash memory remains the preferred nonvolatile technology for discrete memories in embedded systems requiring fast boot and high read throughputs. For applications where the cost-performance balance requires the designer to lean on the side of savings, they have been able to take advantage of NOR flash devices using the lower pin count Serial Peripheral Interface (SPI) to optimize the memory subsystem. Systems using SPI NOR flash memories have achieved 80 MB/s throughputs using a double data rate (DDR) Quad SPI protocol while retaining compatibility with the original interface specified more than 25 years ago.&nbspAs system-level read throughput continues to demand ever-increasing speeds, a new look at the embedded memory interface offers a solution. Read more... Hybrid Flash Architectures Promise Instant-on Dashboard Displays The growing demand for infotainment and connectivity also means that higher memory densities and faster performance will be required in automotive dashboards. Data throughput has become incredibly important to deliver the type of rich graphics required y in-cluster or navigation systems. No single type of nonvolatile memory can satisfy all requirements – NOR flash cannot cover the high-density requirements, while NAND flash lacks the ability for random-access read. Instead, designers need to develop hybrid systems in which parallel or serial NOR flash enables a fast and secure boot while NAND flash offers higher densities for applications and data. With a variety of options available, OEMs can develop solutions to exactly meet their needs. Read more...   Featured White Papers Energy Comparison of Cypress F-RAM and EEPROM F-RAM (Ferroelectric Random Access Memory) is a nonvolatile memory that uses a ferroelectric capacitor to store data. It offers higher write speeds and lower energy consumption than flash/EEPROM. This white paper compares the energy consumption of the Cypress F-RAM and EEPROM under typical application scenarios. Read more... F-RAM, nvSRAM, and MRAM Magnetic Field Immunity Nonvolatile random-access memory (NVRAM) is memory that provides fast read and write access to any address and retains data when power is disrupted. F-RAM, nonvolatile static random-access memory (nvSRAM), and magnetoresistive random-access memory (MRAM) are three types of NVRAMs that offer faster random access times than conventional nonvolatile memories, such as flash and EEPROM. Many nonvolatile memory applications are exposed to magnetic fields, therefore, nonvolatile memory components used in these applications must be immune to the magnetic field effect to protect critical system data. This white paper compares the magnetic field immunity of F-RAM, nvSRAM, and MRAM. Read more… QDR® -IV: The Next Generation of the Highest-Performance Memory Standard for Leading-Edge Networking Systems As networking and computing equipment providers scale their solutions to meet the demands of the Internet, memory capabilities increasingly govern system performance gains. Routers, switches, and high-performance computing systems all require memories that can transact with processing elements at ever-increasing rates. Random transaction rate (RTR), the number of random read or write accesses that a memory can support, therefore, becomes the key memory metric. This white paper discusses how Cypress's QDR-IV provides the highest RTR and standards-based solution to meet these system challenges. It provides a detailed comparison of QDR-IV with alternate memory solutions like DRAM and RLDRAM. It also provides an overview on the concept of Banking and its different implementations in QDR-IV, DRAM and RLDRAM. Read more... Product Features Featured Videos Cypress, the worldwide leader in SRAMs, now offers the newest and highest-performing of the consortium-defined QDR family; QDR-IV. This video introduces QDR-IV, presents the random transaction rate, (RTR) metrics and other benefits offered beyond competitors.   Roadmaps Click here to view the latest Cypress memory roadmaps. EVP Corner with Dana Nazarian Spansion Adds Value Beyond Flash By Dana Nazarian, EVP, Memory Products Division Just a few weeks ago, Cypress and Spansion joined forces in a multi-billion dollar merger. Many of you have been asking me what this marriage between two very complementary companies means in terms of our product offerings and the combined value that we can now bring to our customers. It may sound a bit cliché, but the combination of Spansion and Cypress is a prime example of how two companies coming together can add up to much more than the some of its parts. I am truly very excited about the opportunities that lie ahead. If you haven't had the opportunity, I would encourage you to read the President's Letter in Cypress's 2014 annual report, which was just recently published. In it, our CEO, T.J. Rodgers, describes how Cypress's leadership in SRAMs and Spansion's leadership in NOR Flash bring together the world's broadest portfolio and highest-performance memories for embedded systems under one roof. Furthermore, Cypress has become a one-stop shop for MCUs and memories in automotive systems, which has the potential to become a big growth opportunity for us. I am very pleased to welcome the Spansion flash memory business unit to Cypress and in particular, Ali Pourkeramati, an industry veteran with more than 30 years of experience in nonvolatile memories. Ali will join me in running the Memory Products Division as executive vice president of memory strategy, technology and new products. I am looking forward to working with each of you to ensure that we are continuing to exceed your expectations and earning your trust in Cypress.

An eBook on low power design

From   Download an eBook on Low-Power Design Essential Highlights of Low-Power Design The market forces driving today's board-level design engineering are clear and dramatic. Whether you work in consumer products or industrial process control, intelligent low-power design defines success in the face of miniaturization's attack on available PCB space, as well as embedded design and wireless sensor requirements. This Technology Roundup is a comprehensive series that informs you of effective design tactics such as reducing component count in addition to different types of efficient energy storage available now.   eBook articles include: New Approaches to High-Efficiency Current Sensing Eliminating DRAM from Embedded HMI Designs Low-Power Wireless for the loT Minimizing Power Draw in Small, Portable Devices   Click here to view Newark's privacy policy. UBM, a UBM Company, 303 Second Street, Suite 900 South Tower, San Francisco, CA 94107 USA UBM LLC Privacy Policy

 

Perfect 40-year-old algorithm and more links

June 17, 2015 Wednesday Edition From Electronic Products, here are the latest articles, research and products to inspire your design. Tabletop holographic display pulls media from your smartphone to make it 3D Canadian startup wants to make holograms the futuristic technology that sci-fi movies have been promising us it would be for years.…more Virtual tour lets users explore the International Space Station Similar to Google Maps, but inside a spaceship…more Computer scientists admit 40-year-old algorithm is perfect, cannot be improved upon An algorithm used to establish the edit distance between two sequences of symbols has proven so efficient, it simply cannot be improved upon…more Confirmed: May's A400M airplane crash caused by software bug in the engines Key files dictating torque response were deleted during software installation prior to its first flight…more It's Packaging & Hardware Week on ElectronicProducts.com This week Electronic Products is highlighting packaging & hardware. The packaging & hardware category includes adhesives, sealants and coatings; device packaging; enclosures, cabinets and chassis; fasteners, retainers, panels and clips; prototyping tools, equipment and services; and shielding and insulation.…more Tech Zone - Energy Harvesting Solutions: How to Use Energy Harvesting in High Reliability Industrial Control Environments America II is a leader in distribution. We're one of the largest distributors of semiconductors in the world. America II offers the most complete range of products, from active, passive and electromechanical components to memory and specialty products. America II can support any application or market segment including automotive, industrial, white goods, military, telecommunications, medical, consumer electronics, and so much more. Learn how we can support your production needs. Enabling Multi-band Multi-standard Wireless Coexistence Wireless connectivity has become an integral part of modern day life as wireless communications have made it easier for people to live, work and play. The latest mobile phones and car radios can receive and process a multitude of wireless signals over a wide spectrum of frequency bands, enabling voice/text communications, location-based applications, internet connectivity, device-to-device communications, and radio and TV services. Today's heterogeneous wireless ecosystem supports a myriad of wireless standards such as 4G/LTE, WiFi, GPS, Bluetooth and SDARS. Smallest 20-A power module gets 93% efficiency The XR79120 is a 20-A single output, synchronous step-down power module in the industry's smallest 12 x 14 x 4-mm footprint.…more EVM helps develop HD projection in compact uses The TI DLP 4710 EVM helps engineers assess the capabilities of the DLP HD display chipset for many applications including wearables.…more AEC-Q101 qualified TVS Diodes from Littelfuse protect sensitive automotive electronics from load dump, other transient voltages The global leader in circuit protection has introduced the TP6KE series automotive TVS Diodes.…more Resistors support high temperature operation W and WS series of ceramic core axial wirewound resistors…more Follow us on: Electronic Products, 50 Charles Lindbergh Boulevard, Uniondale, NY 11553

Free Webinar Registration

From Design News.., Join them on Wednesday, June 24th at 2PM EDT as they present a 60 minute free webinar with live Q&A titled "Continuing Advances in 3D Printing for Low-Run Production Applications". 3D printing continues to be a rapidly evolving field, and the breadth of its practical usage is expanding. Following Design News' 3D printing webinars last year, many of you wanted to know more about "real-world" production applications for 3D printing. Jon Baklund, President of Baklund R&D LLC, will be presenting: • The latest examples of small-volume manufacturing using high-performance plastics • How advances in thermoplastics, machinery, and user knowledge have increasingly enabled direct manufacturing of end-use parts in aerospace, medical, and other applications • Examples where high part complexity made AM the optimal production method for low-quantity runs • How it can produce high-quality surface finishes that meet production requirements Busy that Wednesday? Register anyway - they will send you a link to view the recording. Sponsored by: Click here to view the Stratasys privacy policy Click here to view UBM Canon's privacy policy. UBM Canon | 2901 28th St., Ste. 100 | Santa Monica, CA 90405 USA